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Luc Martens
High-Frequency Characterization of Electronic Packaging
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2679798High-Frequency Characterization of Electronic Packaginghttps://www.gandhi.com.mx/high-frequency-characterization-of-electronic-packaging-9781461556237/phttps://gandhi.vtexassets.com/arquivos/ids/3357898/b20ba974-7dbf-49a8-a27d-24c470b66f38.jpg?v=63838525919483000017321925MXNSpringer USInStock/Ebooks/<p><em>High-Frequency Characterization of Electronic Packaging</em> will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.<br /><em>High-Frequency Characterization of Electronic Packaging</em> gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.<br /><em>High-Frequency Characterization of Electronic Packaging</em> is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.</p>...2615728High-Frequency Characterization of Electronic Packaging17321925https://www.gandhi.com.mx/high-frequency-characterization-of-electronic-packaging-9781461556237/phttps://gandhi.vtexassets.com/arquivos/ids/3357898/b20ba974-7dbf-49a8-a27d-24c470b66f38.jpg?v=638385259194830000InStockMXN99999DIEbook20139781461556237_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_<p><em>High-Frequency Characterization of Electronic Packaging</em> will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.<br /><em>High-Frequency Characterization of Electronic Packaging</em> gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.<br /><em>High-Frequency Characterization of Electronic Packaging</em> is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.</p>(*_*)9781461556237_<p><em>High-Frequency Characterization of Electronic Packaging</em> will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.<br /><em>High-Frequency Characterization of Electronic Packaging</em> gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.<br /><em>High-Frequency Characterization of Electronic Packaging</em> is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.</p>...9781461556237_Springer USlibro_electonico_9e9d580b-ac35-33c3-b31f-a5f9864bc74a_9781461556237;9781461556237_9781461556237Luc MartensInglésMéxico2013-11-27T00:00:00+00:00Springer US